High Throughput Wet Etch Solution for BEOL TiN Removal

Solid State Phenomena 2016 / 9 Vol. 255

High Throughput Wet Etch Solution for BEOL TiN Removal

Hsu, Chia Jung, Wang, Chieh Ju, Tu, Sheng Hung, Payne, Makonnen, Cooper, Emanuel, Lippy, Steven
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Volume:
255
Language:
english
Journal:
Solid State Phenomena
DOI:
10.4028/www.scientific.net/SSP.255.245
Date:
September, 2016
File:
PDF, 237 KB
english, 2016
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