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Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model
Yeh, Meng-Kao, Lu, Chun-LinVolume:
63
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.06.001
Date:
August, 2016
File:
PDF, 2.42 MB
english, 2016