Reliability analysis of 3D heterogeneous microsystem module...

Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model

Yeh, Meng-Kao, Lu, Chun-Lin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
63
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2016.06.001
Date:
August, 2016
File:
PDF, 2.42 MB
english, 2016
Conversion to is in progress
Conversion to is failed