Volume 63

Microelectronics Reliability

Volume 63

1

Chip package interaction for LED packages

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.27 MB

english, 2016

2

Resistive switching properties of a thin SiO2 layer with CeOx buffer layer on n+ and p+Si bottom electrodes

Hadi, M.S., Sugii, N., Wakabayashi, H., Tsutsui, K., Iwai, H., Kakushima, K.

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 744 KB

english, 2016

3

Modeling and analysis of crosstalk induced overshoot/undershoot effects in multilayer graphene nanoribbon interconnects and its impact on gate oxide reliability

Sahoo, M., Rahaman, H.

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.28 MB

english, 2016

4

PVTA-aware approximate custom instruction extension technique: A cross-layer approach

Farahani, Bahar, Safari, Saeed, Sehatbakhsh, Nader

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.72 MB

english, 2016

5

Editorial Board

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 36 KB

english, 2016

6

Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages

Mahan, Kenny, Kim, Byung, Wu, Bulong, Han, Bongtae, Kim, Ilho, Moon, Hojeong, Hwang, Young Nam

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 2.03 MB

english, 2016

7

Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material

Wang, Tzu-Hao, Lee, Hsuan, Chen, Chih-Ming, Chen, Ming-Guan, Hu, Chi-Chang, Chen, Yu-Jie, Horng, Ray-Hua

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 2.39 MB

english, 2016

8

Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs

Garegnani, Giacomo, Fiori, Vincent, Gouget, Gilles, Monsieur, Frederic, Tavernier, Clement

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.20 MB

english, 2016

9

High-resolution wide-band LC-VCO for reliable operation in phase-locked loops

Sánchez-Azqueta, C., Aguirre, J., Gimeno, C., Aldea, C., Celma, S.

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.13 MB

english, 2016

10

Drop-shock reliability improvement of embedded chip resistor packages through via structure modification

Park, Se-Hoon, Park, Jong Chul, Park, Jae-Yong, Kim, Young-Ho

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.60 MB

english, 2016

11

On designing an efficient numerical-based forbidden pattern free crosstalk avoidance codec for reliable data transfer of NoCs

Shirmohammadi, Zahra, Miremadi, Seyed Ghassem

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.13 MB

english, 2016

12

Microstructural evolution of sintered silver at elevated temperatures

Paknejad, Seyed Amir, Mansourian, Ali, Greenberg, Julian, Khtatba, Khalid, Van Parijs, Linde, Mannan, Samjid H.

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.99 MB

english, 2016

13

Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography

Usui, Masanori, Kimura, Hidehiko, Satoh, Toshikazu, Asada, Takashi, Yamaguchi, Satoshi, Kato, Masashi

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.74 MB

english, 2016

14

Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications

Kim, Dae Up, Kim, Kwang-Seok, Jung, Seung-Boo

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.13 MB

english, 2016

15

Book Review

Gan, Chong Leong, Hashim, Uda

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 117 KB

english, 2016

16

Applications of the pulsed current-voltage (I-V) and capacitance-voltage (C-V) techniques for high-resistive gates in MOSFETs

Lai, LiLung, Wu, Xiaojing

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.89 MB

english, 2016

17

Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model

Yeh, Meng-Kao, Lu, Chun-Lin

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 2.42 MB

english, 2016