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Warpage of embossed thermoplastic substrates and the effects on solvent bonding
Chen, Pin-Chuan, Yen, Ya-ChiaoVolume:
23
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-016-3035-8
Date:
July, 2017
File:
PDF, 1.48 MB
english, 2017