Influence of extreme thermal cycling on metal-polymer...

Microelectronic Engineering 2017 / 01 Vol. 167

Influence of extreme thermal cycling on metal-polymer interfaces

Putz, Barbara, Völker, Bernhard, Semprimoschnig, Christopher, Cordill, Megan J.
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Volume:
167
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.10.012
Date:
January, 2017
File:
PDF, 1.23 MB
english, 2017
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