Microelectronic Engineering

1

Evaluation of multilayer graphene for advanced interconnects

Politou, Maria, Wu, Xiangyu, Asselberghs, Inge, Contino, Antonino, Soree, Bart, Radu, Iuliana, Huyghebaert, Cedric, Tokei, Zsolt, De Gendt, Stefan, Heyns, Marc

Journal:

Year:

2017

Language:

english

File:

PDF, 945 KB

english, 2017

2

Influence of extreme thermal cycling on metal-polymer interfaces

Putz, Barbara, Völker, Bernhard, Semprimoschnig, Christopher, Cordill, Megan J.

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 1.23 MB

english, 2017

3

Optimization and upscaling of spin coating with organosilane monolayers for low-k pore sealing

Sun, Yiting, Negreira, Ainhoa Romo, Meersschaut, Johan, Hoflijk, Ilse, Vaesen, Inge, Conard, Thierry, Struyf, Herbert, Tokei, Zsolt, Boemmels, Juergen, Moinpour, Mansour, De Feyter, Steven, Armini, Si

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 467 KB

english, 2017

4

Resistivity scaling in metallic thin films and nanowires due to grain boundary and surface roughness scattering

Moors, Kristof, Sorée, Bart, Magnus, Wim

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 870 KB

english, 2017

5

Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes

Jafarpour, Saeed Motaragheb, Kini, Mandar, Schulz, Stefan E., Hermann, Sascha

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 1.58 MB

english, 2017

6

First stages of Pd/Ge reaction: Mixing effects and dominant diffusing species

Perrin Toinin, J., Portavoce, A., Texier, M., Bertoglio, M., Hoummada, K.

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 2.68 MB

english, 2017

7

Hydrogen plasma effect toward the AZO/CuCr/AZO transparent conductive electrode

Lin, Tien-Chai, Huang, Wen-Chang, Tsai, Fu-Chun

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 1.07 MB

english, 2017

8

Stability enhancement of low temperature thin-film transistors with atomic-layer-deposited ZnO:Al channels

Liu, Wen-Jun, Wang, You-Hang, Zheng, Li-Li, Lu, Hong-Liang, Ding, Shi-Jin

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 2.15 MB

english, 2017

9

Conformal isolation of high-aspect-ratio TSVs using a low-κ dielectric deposited by filament-assisted CVD

Jousseaume, V., Altemus, B., Ribière, C., Minoret, S., Gottardi, M., Ratin, C., Ichiki, K., Mourier, T., Faguet, J.

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 1.29 MB

english, 2017

10

Properties of power electronic substrates based on thick printed copper technology

Reboun, Jan, Hromadka, Karel, Hermansky, Vojtech, Johan, Jan

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 1.05 MB

english, 2017

11

Edge trimming for surface activated dielectric bonded wafers

Inoue, Fumihiro, Jourdain, Anne, Visker, Jakob, Peng, Lan, Moeller, Berthold, Yokoyama, Kaori, Phommahaxay, Alain, Rebibis, Kenneth June, Miller, Andy, Beyne, Eric, Sleeckx, Erik

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 1.35 MB

english, 2017

12

Preface

Wilson, Christopher J., Detavernier, Christophe

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 119 KB

english, 2017

13

Editorial Board

Journal:

Microelectronic Engineering

Year:

2017

File:

PDF, 80 KB

2017

14

Author Index

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 127 KB

english, 2017

16

Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure

Mizushima, Yoriko, Kim, Youngsuk, Nakamura, Tomoji, Uedono, Akira, Ohba, Takayuki

Journal:

Microelectronic Engineering

Year:

2017

Language:

english

File:

PDF, 2.38 MB

english, 2017

Volume 167

Evaluation of multilayer graphene for advanced interconnects

Influence of extreme thermal cycling on metal-polymer interfaces

Optimization and upscaling of spin coating with organosilane monolayers for low-k pore sealing

Resistivity scaling in metallic thin films and nanowires due to grain boundary and surface roughness scattering

Effects of catalyst configurations and process conditions on the formation of catalyst nanoparticles and growth of single-walled carbon nanotubes

First stages of Pd/Ge reaction: Mixing effects and dominant diffusing species

Hydrogen plasma effect toward the AZO/CuCr/AZO transparent conductive electrode

Stability enhancement of low temperature thin-film transistors with atomic-layer-deposited ZnO:Al channels

Conformal isolation of high-aspect-ratio TSVs using a low-κ dielectric deposited by filament-assisted CVD

Properties of power electronic substrates based on thick printed copper technology

Edge trimming for surface activated dielectric bonded wafers

Preface

Editorial Board

Table of Contents

Author Index

Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure