Shear Fracture Behavior on Ball Grid Arrayed...

MATERIALS TRANSACTIONS 2005 Vol. 46; Iss. 11

Shear Fracture Behavior on Ball Grid Arrayed Tin–Silver–Copper Solder/Pure Copper Pad Joint Interface

Noguchi, Kunihiro, Endou, Y\\={u}ya, Shimizu, Isao, Ohno, Yasuhide
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Volume:
46
Year:
2005
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.46.2372
File:
PDF, 423 KB
english, 2005
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