Volume 46; Issue 11

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MATERIALS TRANSACTIONS
Volume 46; Issue 11

MATERIALS TRANSACTIONS

Volume 46; Issue 11

1

Formation of Intermetallic Compounds in the Ni Bearing Lead Free Composite Solders

Lee, Joo Won, Lee, Zin Hyoung, Lee, Hyuck Mo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 412 KB

english, 2005

2

Shear Fracture Behavior on Ball Grid Arrayed Tin–Silver–Copper Solder/Pure Copper Pad Joint Interface

Noguchi, Kunihiro, Endou, Y\\={u}ya, Shimizu, Isao, Ohno, Yasuhide

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 423 KB

english, 2005

3

Reliability of Sn–8 mass%Zn–3 mass%Bi Lead-Free Solder and Zn Behavior

Cho, Sun-Yun, Lee, Young-Woo, Kim, Kyoo-Seok, Moon, Young-Jun, Lee, Ji-Won., Han, Hyun-Joo, Kim, Mi-Jin, Jung, Jae-Pil

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 451 KB

english, 2005

4

Interfacial Reaction and Mechanical Characterization of Eutectic Sn–Zn/ENIG Solder Joints during Reflow and Aging

Yoon, Jeong-Won, Chun, Hyun-Suk, Jung, Seung-Boo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 749 KB

english, 2005

5

Microstructure Control in Sn–0.7 mass%Cu Alloys

Nogita, Kazuhiro, Read, Jonathan, Nishimura, Tetsuro, Sweatman, Keith, Suenaga, Shoichi, Dahle, Arne K.

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 437 KB

english, 2005

6

The Dependence of Coating Characteristics on Progress Parameters and Alloy Compositions

Terleeva, Olga. P., Oh, Young-Joo, Ok, Myoung-Ryul, Utkin, Vladimir V., Ha, Heon-Phil, Lee, Dong-Heon

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 220 KB

english, 2005

7

Tensile Properties of Diffusion Bonds between TiAl Intermetallic Compound and Titanium Alloy

Kanai, Satoru, Seto, Sachio, Sugiura, Hiroyuki

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 280 KB

english, 2005

8

Mechanism and Prevention of Spontaneous Tin Whisker Growth

Tu, King-Ning, Suh, Jong-ook, Wu, Albert Tzu-Chia, Tamura, Nobumichi, Tung, Chih-Hang

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 629 KB

english, 2005

9

Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method

Kim, Dae-Gon, Jung, Seung-Boo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 250 KB

english, 2005

10

Interfacial Reaction between Sn–Ag–Co Solder and Metals

Nishikawa, Hiroshi, Komatsu, Akira, Takemoto, Tadashi

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 242 KB

english, 2005

11

Interfacial Properties of Zn–Sn Alloys as High Temperature Lead-Free Solder on Cu Substrate

Lee, Jae-Ean, Kim, Keun-Soo, Suganuma, Katsuaki, Takenaka, Junichi, Hagio, Koichi

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 406 KB

english, 2005

12

Development of Observation Method for Tempered Martensite Microstructure Using Chemical Mechanical Polishing Technique

Hayakawa, Masao, Matsuoka, Saburo, Furuya, Yoshiyuki, Ono, Yoshinori

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 766 KB

english, 2005

13

Grain Refinements of Al–Mg Alloy by Hydrogen Heat-Treatments

Kamegawa, Atsunori, Funayama, Takao, Takahashi, Junya, Takamura, Hitoshi, Okada, Masuo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 258 KB

english, 2005

14

Ferrite Grain Size Formed by Large Strain-High Z Deformation in a 0.15C Steel

Murty, S. V. S. Narayana, Torizuka, Shiro, Nagai, Kotobu

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 656 KB

english, 2005

15

Preparation of TiB2–SiC Eutectic Composite by an Arc-Melted Method and Its Characterization

Li, Wen-Jun, Tu, Rong, Goto, Takashi

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 367 KB

english, 2005

16

Ce–Cu–Fe–Al–Si Bulk Metallic Glass Alloys With High Glass Forming Ability

Bian, Zan, Inoue, Akihisa

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 248 KB

english, 2005

17

Fatigue Reliability Evaluation for Sn–Zn–Bi and Sn–Zn Lead-Free Solder Joints

Yu, Qiang, Jin, Jae-Chul, Kim, Do-Seop, Shiratori, Masaki

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 227 KB

english, 2005

18

IMC Growth of Solid State Reaction between Ni UBM and Sn–3Ag–0.5Cu and Sn–3.5Ag Solder Bump Using Ball Place Bumping Method during Aging

Ishikawa, Shinji, Hashino, Eiji, Kono, Taro, Tatsumi, Kohei

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 587 KB

english, 2005

19

Joints Soldered on Electroless Ni–Au Surfaces Using Cu-Containing Flux: Strength, Microstructure and Mechanism of Improvement

Kumamoto, Seishi, Sakurai, Hitoshi, Ikeda, Kazuki, Suganuma, Katsuaki

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 266 KB

english, 2005

20

Study on Sn–Ag Oxidation and Feasibility of Room Temperature Bonding of Sn–Ag–Cu Solder

Wang, Ying-Hui, Howlader, Matiar R, Nishida, Kenji, Kimura, Takashi, Suga, Tadatomo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 138 KB

english, 2005

21

Residual Stress Distribution in Thermally Sprayed Self-Fluxing Alloy Coatings

Otsubo, Fumitaka, Kishitake, Katsuhiko, Terasaki, Toshio

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 312 KB

english, 2005

22

Fabrication of Cemented Carbide Molds with Internal Cooling Channels Using Hybrid Process of Powder Layer Compaction and Milling

Mizukami, Yoshiaki, Osakada, Kozo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 372 KB

english, 2005

23

Nanosize Particles of ZrVFe Alloy by Pulsed Laser Ablation in Ethanol

Kil, Daesup, Suh, Yongjae, Jang, Heedong, Lee, Jaechen, Song, Changbin, Kim, Wonbaek

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 292 KB

english, 2005

24

Microstructure and Thermoelectric Properties of Hot-Pressed n-Type Bi1.9Sb0.1Te2.6Se0.4 Alloys Prepared Using a Rapid Solidification Technique

Horio, Yuma, Yamashita, Hiroyuki, Hayashi, Takahiro

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 283 KB

english, 2005

25

Ag–Ti Alloy Used in ITO–Metal–ITO Transparency Conductive Thin Film with Good Durability against Moisture

Chen, Shi-Wei, Koo, Chun-Hao, Huang, Hsin-Erh, Chen, Chia-Hua

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 200 KB

english, 2005

26

A Bulk Glassy Cu–Zr–Ti–Sn Alloy with Superior Plasticity

Men, Hua, Zhang, Tao

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 249 KB

english, 2005

27

Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen

Kariya, Yoshiharu, Niimi, Tomokazu, Suga, Tadatomo, Otsuka, Masahisa

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 561 KB

english, 2005

28

Estimation of Thermal Fatigue Resistances of Sn–Ag and Sn–Ag–Cu Lead-Free Solders Using Strain Rate Sensitivity Index

Shohji, Ikuo, Yasuda, Kiyokazu, Takemoto, Tadashi

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 337 KB

english, 2005

29

Fatigue Damage Evaluation by Surface Feature for Sn–3.5Ag and Sn–0.7Cu Solders

Takahashi, Takehiko, Hioki, Susumu, Shohji, Ikuo, Kamiya, Osamu

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 993 KB

english, 2005

30

Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing

Lee, Jaesik, Jung, Jae-Pil, Cheon, Chu-Seon, Zhou, Yunhong, Mayer, Michael

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 449 KB

english, 2005

31

Microstructural Evolution of Joint Interface between Eutectic 80Au–20Sn Solder and UBM

Kim, Sung Soo, Kim, Jong Hoon, Booh, Seong Woon, Kim, Tae-Gyu, Lee, Hyuck Mo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 315 KB

english, 2005

32

Reactivity between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases

Yamamoto, Takashi, Sakatani, Shigeaki, Kobayashi, Shinji, Uenishi, Keisuke, Kobayashi, Kojiro F., Ishio, Masaaki, Shiomi, Kazuhiro, Hashimoto, Akio, Yamamoto, Masaharu

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 353 KB

english, 2005

33

Isoplethal Sections of the Liquidus Projection and the 250°C Phase Equilibria of the Sn–Ag–Cu–Ni Quaternary System at the Sn-Rich Corner

Chiu, Chen-nan, Huang, Yu-chih, Zi, An-ren, Chen, Sinn-wen

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 263 KB

english, 2005

34

Identification of β Phase Particles in an Isothermally Aged Al–10 mass%Mg–0.5 mass%Ag Alloy

Kubota, Masahiro

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 328 KB

english, 2005

35

Empirical Equations for Bubble Formation Frequency from Downward-Facing Nozzle with and without Rotating Flow Effects

Goda, Tomoya, Iguchi, Manabu, Sasaki, Yasushi, Kiuchi, Hiromichi

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 170 KB

english, 2005

36

Influence of Heat Treatment on the Distribution of Ni2Nb and Microsegregation in Cast Inconel 718 Alloy

El-Bagoury, Nader, Matsuba, Toru, Yamamoto, Kaoru, Miyahara, Hirofumi, Ogi, Keisaku

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 554 KB

english, 2005

37

AE Source and Relation between AE Activity and Rate of Corrosion of Oil Tank Bottom Plate on Acidic Soils

Park, Sosoon, Kitsukawa, Shigeo, Katoh, Kenji, Yuyama, Sigenori, Maruyama, Hiroaki, Sekine, Kazuyoshi

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 160 KB

english, 2005

38

Orientation of Hydroxyapatite C-Axis under High Magnetic Field with Mold Rotation and Subsequent Sintering Process

Akiyama, Jun, Hashimoto, Masami, Takadama, Hiroaki, Nagata, Fukue, Yokogawa, Yoshiyuki, Sassa, Kensuke, Iwai, Kazuhiko, Asai, Shigeo

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 313 KB

english, 2005

39

Bi2Te3-Related Thermoelectric Samples with Aligned-Texture Prepared by Plastic Deformation

Morisaki, Yoshinori, Araki, Hiroshi, Kitagawa, Hiroyuki, Orihashi, Masaki, Hasezaki, Kazuhiro, Kimura, Keiichi

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 268 KB

english, 2005

40

Effects of Substrate Temperature and Oxygen Pressure on Crystallographic Orientations of Sputtered Nickel Oxide Films

Chen, Hao-Long, Lu, Yang-Ming, Wu, Jun-Yi, Hwang, Weng-Sing

Journal:

MATERIALS TRANSACTIONS

Year:

2005

Language:

english

File:

PDF, 253 KB

english, 2005

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