Via Resistance Reduction in Advanced Copper Interconnects

IEEE Electron Device Letters 2017 / 1 Vol. 38; Iss. 1

Via Resistance Reduction in Advanced Copper Interconnects

Yang, C.-C., Spooner, T., Mclaughlin, P., Quon, R., Standaert, T., Edelstein, D.
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Volume:
38
Language:
english
Journal:
IEEE Electron Device Letters
DOI:
10.1109/led.2016.2628813
Date:
January, 2017
File:
PDF, 388 KB
english, 2017
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