Improved Performance and Heat Dissipation of Flip-Chip...

IEEE Transactions on Device and Materials Reliability 2017 / 3 Vol. 17; Iss. 1

Improved Performance and Heat Dissipation of Flip-Chip White High-Voltage Light Emitting Diodes

Wu, Ping-Chen, Ou, Sin-Liang, Horng, Ray-Hua, Wuu, Dong-Sing
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2016.2646362
Date:
March, 2017
File:
PDF, 654 KB
english, 2017
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