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Process Innovations to Prevent Glass Substrate Fracture From RDL Stress and Singulation Defects
McCann, Scott, Singh, Bhupender, Smet, Vanessa, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.Volume:
16
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2016.2614246
Date:
December, 2016
File:
PDF, 1.82 MB
english, 2016