Complex 3D structures via double imprint of hybrid...

Microelectronic Engineering 2017 / 05 Vol. 176

Complex 3D structures via double imprint of hybrid structures and sacrificial mould techniques

Steinberg, Christian, Rumler, Maximilian, Runkel, Manuel, Papenheim, Marc, Wang, Si, Mayer, Andre, Becker, Marco, Rommel, Mathias, Scheer, Hella-Christin
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Volume:
176
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2017.01.009
Date:
May, 2017
File:
PDF, 852 KB
english, 2017
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