High throughput soft embossing process for micro-patterning...

Microelectronic Engineering 2017 / 05 Vol. 176

High throughput soft embossing process for micro-patterning of PEDOT thin films

Fanzio, Paola, Cagliani, Alberto, Peterffy, Kristof G., Sasso, Luigi
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Volume:
176
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2017.01.011
Date:
May, 2017
File:
PDF, 2.02 MB
english, 2017
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