Effect of Microstructure and Anisotropy of Copper on...

IEEE Transactions on Device and Materials Reliability 2017 / 3 Vol. 17; Iss. 1

Effect of Microstructure and Anisotropy of Copper on Reliability in Nanoscale Interconnects

Basavalingappa, Adarsh, Lloyd, James R.
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2017.2655459
Date:
March, 2017
File:
PDF, 1.66 MB
english, 2017
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