Experimental and Numerical Investigation of the Reliability...

Journal of Electronic Packaging 2006 Vol. 128; Iss. 4

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

Chaparala, S., Pitarresi, J. M., Parupalli, S., Mandepudi, S., Meilunas, M.
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Volume:
128
Year:
2006
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2353280
File:
PDF, 948 KB
english, 2006
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