Volume 128; Issue 4

Journal of Electronic Packaging

Volume 128; Issue 4
3

A Graphite Foams Based Vapor Chamber for Chip Heat Spreading

Year:
2006
Language:
english
File:
PDF, 477 KB
english, 2006
4

The Role of Fin Geometry in Heat Sink Performance

Year:
2006
Language:
english
File:
PDF, 603 KB
english, 2006
6

Cooling of Power Electronics by Embedded Solids

Year:
2006
Language:
english
File:
PDF, 842 KB
english, 2006
15

Test Methods for Silicon Die Strength

Year:
2006
Language:
english
File:
PDF, 1.02 MB
english, 2006
17

Singulation of Electronic Packages With Abrasive Waterjets

Year:
2006
Language:
english
File:
PDF, 586 KB
english, 2006
20

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Year:
2006
Language:
english
File:
PDF, 1.04 MB
english, 2006