Effects of dimension parameters and defect on TSV thermal...

Microelectronics Reliability 2017 / 03 Vol. 70

Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging

Pan, Yuanxing, Li, Fei, He, Hu, Li, Junhui, Zhu, Wenhui
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Volume:
70
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.02.001
Date:
March, 2017
File:
PDF, 1.69 MB
english, 2017
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