Volume 70

Microelectronics Reliability

Volume 70

1

Comparison of hydrothermal performance between plate fins and plate-pin fins subject to nanofluid-cooled corrugated miniature heat sinks

Khoshvaght-Aliabadi, M., Hassani, S.M., Mazloumi, S.H.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 6.35 MB

english, 2017

2

Erosion defect formation in Ni-gate AlGaN/GaN high electron mobility transistors

Whiting, P.G., Holzworth, M.R., Lind, A.G., Pearton, S.J., Jones, K.S., Liu, L., Kang, T.S., Ren, F., Xin, Y.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.76 MB

english, 2017

3

Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

Baïri, A., Roseiro, L., Martín-Garín, A., Adeyeye, K., Millán-García, J.A.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 884 KB

english, 2017

4

Review of silver nanoparticle based die attach materials for high power/temperature applications

Paknejad, Seyed Amir, Mannan, Samjid H.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.77 MB

english, 2017

5

Investigation of dependence between time-zero and time-dependent variability in high-κ NMOS transistors

Hassan, Mohammad Khaled, Roy, Kaushik

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 3.12 MB

english, 2017

6

Corrosion behavior of crystalline silicon solar cells

Xiong, Huaping, Gan, Chuanhai, Yang, Xiaobing, Hu, Zhigang, Niu, Haiyan, Li, Jianfeng, Si, Jianfang, Xing, Pengfei, Luo, Xuetao

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 3.88 MB

english, 2017

7

Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging

Pan, Yuanxing, Li, Fei, He, Hu, Li, Junhui, Zhu, Wenhui

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.69 MB

english, 2017

8

Mechanism of gate dielectric degradation by hydrogen migration from the cathode interface

Higashi, Yusuke, Takaishi, Riichiro, Kato, Koichi, Suzuki, Masamichi, Nakasaki, Yasushi, Tomita, Mitsuhiro, Mitani, Yuichiro, Matsumoto, Masuaki, Ogura, Shohei, Fukutani, Katsuyuki, Yamabe, Kikuo

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.46 MB

english, 2017

9

Nanocrack formation in AlGaN/GaN high electron mobility transistors utilizing Ti/Al/Ni/Au ohmic contacts

Whiting, P.G., Rudawski, N.G., Holzworth, M.R., Pearton, S.J., Jones, K.S., Liu, L., Kang, T.S., Ren, F.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.43 MB

english, 2017

10

Prognostics of Li(NiMnCo)O2-based lithium-ion batteries using a novel battery degradation model

Yang, Fangfang, Wang, Dong, Xing, Yinjiao, Tsui, Kwok-Leung

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.12 MB

english, 2017

11

Interacting multiple model particle filter for prognostics of lithium-ion batteries

Su, Xiaohong, Wang, Shuai, Pecht, Michael, Zhao, Lingling, Ye, Zhe

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.59 MB

english, 2017

12

Methods of sequential test optimization in dynamic environment

Yang, Chenglin, Su, Ruoshan, Long, Bing

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.19 MB

english, 2017

13

Book review

Gan, Chong Leong, Moideen, Mohamad Zainudeen

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 116 KB

english, 2017

14

Peridynamic wetness approach for moisture concentration analysis in electronic packages

Diyaroglu, C., Oterkus, S., Oterkus, E., Madenci, E., Han, S., Hwang, Y.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.76 MB

english, 2017

15

Editorial Board

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 37 KB

english, 2017