Stress Evolution During Nanoindentation in Open TSVs

IEEE Transactions on Device and Materials Reliability 2016 / 12 Vol. 16; Iss. 4

Stress Evolution During Nanoindentation in Open TSVs

Papaleo, Santo, Zisser, Wolfhard H., Singulani, Anderson P., Ceric, Hajdin, Selberherr, Siegfried
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Volume:
16
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2016.2622727
Date:
December, 2016
File:
PDF, 671 KB
english, 2016
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