Moisture Absorption and Diffusion Characterization of...

Journal of Electronic Packaging 2005 Vol. 127; Iss. 4

Moisture Absorption and Diffusion Characterization of Molding Compound

Chen, Xu, Zhao, Shufeng, Zhai, Linda
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Volume:
127
Year:
2005
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2065707
File:
PDF, 581 KB
english, 2005
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