Volume 127; Issue 4

Journal of Electronic Packaging

Volume 127; Issue 4

1

Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu

Zhang, Qian, Dasgupta, Abhijit, Haswell, Peter

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 1.41 MB

english, 2005

2

Thermal Performance Investigation for Confined Heat Sinks By Using a Modified Transient Liquid Crystal Technique

Wu, Ming-Chang, Wu, Tiao-Yuan, Kuo, Sheng-Tzung, Wang, Meng-Ping, Hung, Ying-Huei

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 562 KB

english, 2005

3

Time-Dependent Rheological Behavior of Fluids For Electronics Packaging

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 168 KB

english, 2005

4

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Rambo, Jeffrey, Joshi, Yogendra

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 1.53 MB

english, 2005

5

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

Jansen, K. M. B., Gonda, V., Ernst, L. J., Bressers, H. J. L., Zhang, G. Q.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 559 KB

english, 2005

6

A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks

Qu, Weilin, Mudawar, Issam

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 306 KB

english, 2005

7

Design Optimization for Pin-Fin Heat Sinks

Chen, Han-Ting, Chen, Po-Li, Horng, Jenn-Tsong, Hung, Ying-Huei

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 689 KB

english, 2005

8

Practical Guide to the Packaging of Electronics

Rafanelli, Anthony J.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 29 KB

english, 2005

9

Board Level Drop Impact—Fundamental and Parametric Analysis

Wong, E. H., Mai, Y-W, Seah, S. K. W.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 958 KB

english, 2005

10

Moisture Absorption and Diffusion Characterization of Molding Compound

Chen, Xu, Zhao, Shufeng, Zhai, Linda

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 581 KB

english, 2005

11

Meso Scale Pulsating Jets for Electronics Cooling

Garg, Jivtesh, Arik, Mehmet, Weaver, Stanton, Wetzel, Todd, Saddoughi, Seyed

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 447 KB

english, 2005

12

Environment-Friendly Electronics: Lead-Free Technology

Rafanelli, Anthony J.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 43 KB

english, 2005

13

Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps

Wang, Daijiao, Panton, Ronald L.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 761 KB

english, 2005

14

A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block

Wang, S. Kong, Hung, Tzu-Chen, Pei, Bau-Shi, Chen, An-Fong, Du, Ja-Lin

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 324 KB

english, 2005

15

Behavior of Anisotropic Conductive Film (ACF) Joint Under Mechanical Shock

Islam, Rashed Adnan, Chan, Y. C.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 445 KB

english, 2005

16

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Jen, Ming-Hwa R., Liu, Lee-Cheng, Wu, Jenq-Dah

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 695 KB

english, 2005

17

A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading

Tsukada, Yutaka, Nishimura, Hideo, Yamamoto, Hiroki, Sakane, Masao

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 506 KB

english, 2005

18

Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy

Islam, M. N., Chan, Y. C., Alam, M. O., Sharif, A.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 409 KB

english, 2005

19

Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C, 23 °C, and 125 °C

Obaid, Ahmad Abu, Sloan, Jay G., Lamontia, Mark A., Paesano, Antonio, Khan, Subhotosh, Gillespie, John W.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 1.98 MB

english, 2005

20

Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C, 23 °C, and 125 °C

Obaid, Ahmad Abu, Sloan, Jay G., Lamontia, Mark A., Paesano, Antonio, Khan, Subhotosh, Gillespie, John J.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 1.10 MB

english, 2005

21

Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis

Zhang, Qian, Dasgupta, Abhijit, Nelson, Dave, Pallavicini, Hector

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 2.33 MB

english, 2005

22

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

Radhakrishnan, Satish, Subbarayan, Ganesh, Nguyen, Luu, Mazotti, William P.

Journal:

Journal of Electronic Packaging

Year:

2005

Language:

english

File:

PDF, 815 KB

english, 2005

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