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Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling
Ye, Hua, Efstathiadis, Harry, Haldar, PradeepVolume:
128
Year:
2006
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2229226
File:
PDF, 437 KB
english, 2006