Reliability Prediction of Area Array Solder Joints

Reliability Prediction of Area Array Solder Joints

Dudek, Rainer, Döring, Ralf, Michel, Bernd
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
125
Year:
2003
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1604802
File:
PDF, 317 KB
english, 2003
Conversion to is in progress
Conversion to is failed