An Effective Approach of Improving Electrical and...

IEEE Transactions on Device and Materials Reliability 2017 / 3 Vol. 17; Iss. 1

An Effective Approach of Improving Electrical and Thermo-Mechanical Reliabilities of Through-Silicon Vias

Wang, Fengjuan, Yu, Ningmei
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Volume:
17
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2016.2626306
Date:
March, 2017
File:
PDF, 1.75 MB
english, 2017
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