A routing framework for technology migration with bump...

Integration, the VLSI Journal 2017 / 06 Vol. 58

A routing framework for technology migration with bump encroachment

Wu, Po-Yi, Mak, Wai-Kei, Wang, Ting-Chi, Zhuo, Cheng, Unda, Kassan, Shi, Yiyu
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Volume:
58
Language:
english
Journal:
Integration, the VLSI Journal
DOI:
10.1016/j.vlsi.2017.01.003
Date:
June, 2017
File:
PDF, 1.05 MB
english, 2017
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