Research of Underfill Delamination in Flip Chip by the...

Journal of Electronic Packaging 2004 Vol. 126; Iss. 1

Research of Underfill Delamination in Flip Chip by the J-Integral Method

Xu, Bulu, Cai, Xia, Huang, Weidong, Cheng, Zhaonian
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Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1648061
File:
PDF, 235 KB
english, 2004
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