Monitoring of thermo-mechanical stress via CMOS sensor...

Microelectronics Reliability 2017 / 06 Vol. 73

Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding

Laor, Ari, Athia, Depayne, Rezvani, Alireza, Clauberg, Horst, Mayer, Michael
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Volume:
73
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.03.001
Date:
June, 2017
File:
PDF, 5.63 MB
english, 2017
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