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Volume 73
Main
Microelectronics Reliability
Volume 73
Microelectronics Reliability
Volume 73
1
Performance analysis of heat pipe aided NEPCM heat sink for transient electronic cooling
Suresh Kumar, K.R.
,
Dinesh, R.
,
Ameelia Roseline, A.
,
Kalaiselvam, S.
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 5.49 MB
Your tags:
english, 2017
2
Automatic characterisation method for statistical evaluation of tin whisker growth
Krammer, Olivér
,
Illés, Balázs
,
Bátorfi, Réka
,
Dušek, Karel
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 3.73 MB
Your tags:
english, 2017
3
Single event transient effects on charge redistribution SAR ADCs
Becker, Thales E.
,
Lanot, Alisson J.C.
,
Cardoso, Guilherme S.
,
Balen, Tiago R.
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 2.36 MB
Your tags:
english, 2017
4
Static fault localization of subtle metallization defects using near infrared photon emission microscopy
Quah, A.C.T.
,
Nagalingam, D.
,
Moon, S.
,
Susanto, E.
,
Ang, G.B.
,
Neo, S.P.
,
Lam, J.C.
,
Mai, Z.H.
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 6.71 MB
Your tags:
english, 2017
5
Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding
Laor, Ari
,
Athia, Depayne
,
Rezvani, Alireza
,
Clauberg, Horst
,
Mayer, Michael
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 5.63 MB
Your tags:
english, 2017
6
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
Wang, Mingna
,
Wang, Jianqiu
,
Ke, Wei
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 3.99 MB
Your tags:
english, 2017
7
A method to recover critical bits under a double error in SEC-DED protected memories
Liu, Shanshan
,
Reviriego, Pedro
,
Xiao, Liyi
,
Maestro, Juan Antonio
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 910 KB
Your tags:
english, 2017
8
Experimental and numerical investigation of circular minichannel heat sinks with various hydraulic diameter for electronic cooling application
Ghasemi, Seyed Ebrahim
,
Ranjbar, A.A.
,
Hosseini, M.J.
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 2.37 MB
Your tags:
english, 2017
9
Similarities of lag phenomena and current collapse in field-plate AlGaN/GaN HEMTs with different types of buffer layers
Tsurumaki, Ryouhei
,
Noda, Naohiro
,
Horio, Kazushige
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 1.66 MB
Your tags:
english, 2017
10
Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration
Wang, Fengjiang
,
Li, Dongyang
,
Tian, Shuang
,
Zhang, Zhijie
,
Wang, Jiheng
,
Yan, Chao
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 4.90 MB
Your tags:
english, 2017
11
Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing
Kim, Cheolgyu
,
Lee, Tae-Ik
,
Kim, Min Sung
,
Kim, Taek-Soo
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 2.77 MB
Your tags:
english, 2017
12
Research on the effect of single-event transient of an on-chip linear voltage regulator fabricated on 130 nm commercial CMOS technology
Zhao, QiFeng
,
Yang, GuoQing
,
Sun, YongJie
,
Yu, PeiFu
,
Chen, JianJun
,
Liang, Bin
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 1.29 MB
Your tags:
english, 2017
13
Thermal impedance measurement of integrated inductors on bulk silicon substrate
Kałuża, M.
,
Więcek, B.
,
De Mey, G.
,
Hatzopoulos, A.
,
Chatziathanasiou, V.
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 1.34 MB
Your tags:
english, 2017
14
Random telegraph noise in SiGe HBTs: Reliability analysis close to SOA limit
Mukherjee, C.
,
Jacquet, T.
,
Chakravorty, A.
,
Zimmer, T.
,
Boeck, J.
,
Aufinger, K.
,
Maneux, C.
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 2.89 MB
Your tags:
english, 2017
15
Colorimetric visualization of tin corrosion: A method for early stage corrosion detection on printed circuit boards
Verdingovas, Vadimas
,
Jellesen, Morten Stendahl
,
Ambat, Rajan
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 3.78 MB
Your tags:
english, 2017
16
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions
Wang, Jing
,
Liu, Ruiyang
,
Liu, Dapeng
,
Park, Seungbae
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 2.44 MB
Your tags:
english, 2017
17
Low-voltage triggering SCRs for ESD protection in a 0.35 μm SiGe BiCMOS process
JiZhi, Liu
,
Yaohui, Zeng
,
Zhiwei, Liu
,
Jianming, Zhao
,
Hui, Cheng
,
Nie, Liu
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 2.67 MB
Your tags:
english, 2017
18
Assessment of sense measurement duration on BTI degradation in MG/HK CMOS technologies using a novel stacked transistor test structure
Kerber, Andreas
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 1.31 MB
Your tags:
english, 2017
19
Editorial Board
Journal:
Microelectronics Reliability
Year:
2017
Language:
english
File:
PDF, 38 KB
Your tags:
english, 2017
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