Low Cycle Fatigue Testing of Ball Grid Array Solder Joints...

Journal of Electronic Packaging 2005 Vol. 127; Iss. 3

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

Park, Tae-Sang, Lee, Soon-Bok
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Volume:
127
Year:
2005
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1871192
File:
PDF, 793 KB
english, 2005
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