Void Formation Mechanism of Flip Chip in Package Using...

Journal of Electronic Packaging 2009 Vol. 131; Iss. 3

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Lee, Sangil, Yim, M. J., Baldwin, Daniel
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Volume:
131
Year:
2009
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.3153369
File:
PDF, 1.12 MB
english, 2009
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