Volume 131; Issue 3

Journal of Electronic Packaging

Volume 131; Issue 3
3

Squeezing Flow of a Power Law Fluid Between Grooved Plates

Year:
2009
Language:
english
File:
PDF, 2.82 MB
english, 2009
10

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Year:
2009
Language:
english
File:
PDF, 1.12 MB
english, 2009