Micro-bending testing of electrodeposited gold for...

Microelectronic Engineering 2017 / 08 Vol. 180

Micro-bending testing of electrodeposited gold for applications as movable components in MEMS devices

Asano, Keisuke, Tang, Hao-Chun, Chen, Chun-Yi, Nagoshi, Takashi, Chang, Tso-Fu Mark, Yamane, Daisuke, Machida, Katsuyuki, Masu, Kazuya, Sone, Masato
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Volume:
180
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2017.05.044
Date:
August, 2017
File:
PDF, 1.74 MB
english, 2017
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