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Volume 180
Main
Microelectronic Engineering
Volume 180
Microelectronic Engineering
Volume 180
1
Enhancement of printing overlay accuracy by reducing the effects of mark deformations
Lee, Eonseok
,
Choi, Young-Man
,
Lee, Seung-Hyun
,
Kwon, Sin
,
Lee, Taik-Min
,
Kang, Dongwoo
Journal:
Microelectronic Engineering
Year:
2017
Language:
english
File:
PDF, 1.75 MB
Your tags:
english, 2017
2
PPC-based bilayer temporary bonding and debonding
Zhu, Zhiyuan
,
Xu, Zhiwei
Journal:
Microelectronic Engineering
Year:
2017
Language:
english
File:
PDF, 1.11 MB
Your tags:
english, 2017
3
Micro-bending testing of electrodeposited gold for applications as movable components in MEMS devices
Asano, Keisuke
,
Tang, Hao-Chun
,
Chen, Chun-Yi
,
Nagoshi, Takashi
,
Chang, Tso-Fu Mark
,
Yamane, Daisuke
,
Machida, Katsuyuki
,
Masu, Kazuya
,
Sone, Masato
Journal:
Microelectronic Engineering
Year:
2017
Language:
english
File:
PDF, 1.74 MB
Your tags:
english, 2017
4
Ultrathin FDSOI four-gate transistors (G 4 -FETs)
Athanasiou, Sotirios
,
Bawedin, Maryline
,
Galy, Philippe
,
Cristoloveanu, Sorin
Journal:
Microelectronic Engineering
Year:
2017
Language:
english
File:
PDF, 1.41 MB
Your tags:
english, 2017
5
Dynamics of filling process of through silicon via under the ultrasonic agitation on the electroplating solution
Wang, Fuliang
,
Ren, Xinyu
,
Zeng, Peng
,
Xiao, Hongbin
,
Wang, Yan
,
Zhu, Wenhui
Journal:
Microelectronic Engineering
Year:
2017
Language:
english
File:
PDF, 1.27 MB
Your tags:
english, 2017
6
High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition
Wang, Fuliang
,
Zeng, Peng
,
Wang, Yan
,
Ren, Xinyu
,
Xiao, Hongbin
,
Zhu, Wenhui
Journal:
Microelectronic Engineering
Year:
2017
Language:
english
File:
PDF, 963 KB
Your tags:
english, 2017
7
Enhancement of Cu pillar bumps by electroless Ni plating
Lee, Byung-Suk
,
Jung, Seung-Boo
,
Yoon, Jeong-Won
Journal:
Microelectronic Engineering
Year:
2017
Language:
english
File:
PDF, 690 KB
Your tags:
english, 2017
8
Photoetching method that provides improved silicon-on-insulator layer thickness uniformity in a defined area
Miyata, Yuki
,
Nakamukai, Yasunori
,
Azevedo, Cassia Tiemi
,
Morita, Miho
,
Uchikoshi, Junichi
,
Kawai, Kentaro
,
Arima, Kenta
,
Morita, Mizuho
Journal:
Microelectronic Engineering
Year:
2017
Language:
english
File:
PDF, 526 KB
Your tags:
english, 2017
9
Chemically reduced graphene oxide-based dry electrodes as touch sensor for electrocardiograph measurement
Das, Partha Sarati
,
Hossain, Md Faruk
,
Park, Jae Yeong
Journal:
Microelectronic Engineering
Year:
2017
Language:
english
File:
PDF, 2.63 MB
Your tags:
english, 2017
10
Editorial Board
Journal:
Microelectronic Engineering
Year:
2017
File:
PDF, 32 KB
Your tags:
2017
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