Dynamics of filling process of through silicon via under...

Microelectronic Engineering 2017 / 08 Vol. 180

Dynamics of filling process of through silicon via under the ultrasonic agitation on the electroplating solution

Wang, Fuliang, Ren, Xinyu, Zeng, Peng, Xiao, Hongbin, Wang, Yan, Zhu, Wenhui
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Volume:
180
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2017.05.030
Date:
August, 2017
File:
PDF, 1.27 MB
english, 2017
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