Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder
Huang, Huizhen, Shuai, Gewang, Wei, Xiuqin, Yin, ChuanqiangVolume:
74
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.05.010
Date:
July, 2017
File:
PDF, 1.33 MB
english, 2017