Volume 74

Microelectronics Reliability

Volume 74

1

Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints

Ghosh, Rituparna, Kanjilal, Anwesha, Kumar, Praveen

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.76 MB

english, 2017

2

Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling

Qiu, Delong, Cao, Liqiang, Wang, Qidong, Hou, Fengze, Wang, Xugang

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 3.69 MB

english, 2017

3

Thermal evaluation of GaN-based HEMTs with various layer sizes and structural parameters using finite-element thermal simulation

Liao, Zhiheng, Guo, Chunsheng, Meng, Ju, Jiang, Boyang, Gao, Li, Su, Ya, Wang, Ruomin, Feng, Shiwei

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.79 MB

english, 2017

4

Impact of gate-to-source/drain misalignments on source-side injection Schottky barrier charge-trapping memory cells evaluated using numerical programming-trapping iterations

Shih, Chun-Hsing, Lo, Yen-Hsiang, Chen, Yu-Hsuan, Tsai, Jr-Jie

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.28 MB

english, 2017

5

Influences of silicon-rich shallow trench isolation on total ionizing dose hardening and gate oxide integrity in a 130 nm partially depleted SOI CMOS technology

Song, Lei, Hu, Zhiyuan, Zhang, Mengying, Liu, Xiaonian, Dai, Lihua, Zhang, Zhengxuan, Zou, Shichang

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 3.22 MB

english, 2017

6

Low cost fault tolerance against k c -cycle and k m -unit transient for loop based control data flow graphs during physically aware high level synthesis

Sengupta, Anirban, Kachave, Deepak

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.09 MB

english, 2017

7

Operation of 4H-SiC high voltage normally-OFF V-JFET in radiation hard conditions: Simulations and experiment

Popelka, S., Hazdra, P., Záhlava, V.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.16 MB

english, 2017

8

Threshold-voltage variability analysis and modeling for junctionless double-gate transistors

Chen, Chun-Yu, Lin, Jyi-Tsong, Chiang, Meng-Hsueh

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.76 MB

english, 2017

9

A multiscale analytical correction technique for two-dimensional thermal models of AlGaN/GaN HEMTs

Azarifar, Mohammad, Donmezer, Nazli

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 854 KB

english, 2017

10

Degradation induced by TID radiation and hot-carrier stress in 130-nm short channel PDSOI NMOSFETs

Dai, Lihua, Liu, Xiaonian, Zhang, Mengying, Zhang, Leqing, Hu, Zhiyuan, Bi, Dawei, Zhang, Zhengxuan, Zou, Shichang

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.99 MB

english, 2017

11

A prognostic method for predicting failure of dc/dc converter

Qingchuan, He, Wenhua, Chen, Jun, Pan, Ping, Qian

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.68 MB

english, 2017

12

Improving the ESD self-protection capability of 60 V HV p-channel LDMOS large array device in 0.25 μm BCD process

Chen, Hung-Wei, Chang, Mi-Chang

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.43 MB

english, 2017

13

Effect of roughness on electrical contact performance of electronic components

Liu, Xin-long, Cai, Zhen-bing, Liu, Shan-bang, Peng, Jin-fang, Zhu, Min-hao

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 4.52 MB

english, 2017

14

Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components

Vandevelde, Bart, Vanhee, Filip, Pissoort, Davy, Degrendele, Lieven, De Baets, Johan, Allaert, Bart, Lauwaert, Ralph, Zanon, Franco, Labie, Riet, Willems, Geert

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.13 MB

english, 2017

15

Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder

Huang, Huizhen, Shuai, Gewang, Wei, Xiuqin, Yin, Chuanqiang

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.33 MB

english, 2017

16

Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

Wymysłowski, Artur

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 155 KB

english, 2017

17

Junction temperature of QFN32 and 64 electronic devices subjected to free convection. Effects of the resin's thermal conductivity

Baïri, Abderrahmane

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.11 MB

english, 2017

18

Viscoplastic properties of pressure-less sintered silver materials using indentation

Leslie, D., Dasgupta, A., Morillo, Carlos

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.41 MB

english, 2017

19

Book review

Gan, Chong Leong, Moideen, Mohammad Zainudeen

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 111 KB

english, 2017

20

Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor

Palczynska, Alicja, Prisacaru, Alexandru, Gromala, Przemyslaw Jakub, Han, Bongtae, Mayer, Dirk, Melz, Tobias

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.60 MB

english, 2017

21

The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics

Kuczynska, M., Schafet, N., Becker, U., Métais, B., Kabakchiev, A., Buhl, P., Weihe, S.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.87 MB

english, 2017

22

Editorial Board

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 37 KB

english, 2017

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