Failure Analysis of Miniature Solder Specimen

Journal of Electronic Packaging 2004 Vol. 126; Iss. 1

Failure Analysis of Miniature Solder Specimen

Wei, Y., Chow, C. L., Fang, H. E., Neilsen, M. K., Lim, T. J., Lu, W.
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Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1648060
File:
PDF, 261 KB
english, 2004
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