Development of a Two Matrix Model for Thermal Analysis of a...

Development of a Two Matrix Model for Thermal Analysis of a Multichip Module

Butterbaugh, M. A.
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Volume:
119
Year:
1997
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2792251
File:
PDF, 617 KB
english, 1997
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