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Prediction of Surface Temperature and Heat Flux of a Microelectronic Chip With Jet Impingement Cooling
Wang, X. S., Dagan, Z., Jiji, L. M.Volume:
112
Year:
1990
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2904342
File:
PDF, 496 KB
english, 1990