Analysis of Brazing Stresses in Ceramic-Metal Joints in...

Journal of Electronic Packaging 1989 Vol. 111; Iss. 1

Analysis of Brazing Stresses in Ceramic-Metal Joints in High-Vacuum Devices

De Weese, K. L., Toups, C. E., Dharan, C. K. H.
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Volume:
111
Year:
1989
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.3226503
File:
PDF, 798 KB
english, 1989
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