Volume 111; Issue 1

Journal of Electronic Packaging

Volume 111; Issue 1
4

Application of an Epoxy Cap in a Flip-Chip Package Design

Year:
1989
Language:
english
File:
PDF, 431 KB
english, 1989
5

Slow Crack Growth in Glasses and Ceramics Under Residual and Applied Stresses

Year:
1989
Language:
english
File:
PDF, 544 KB
english, 1989
6

Thermal Stress Analysis of SMT PQFP Packages and Interconnections

Year:
1989
Language:
english
File:
PDF, 679 KB
english, 1989
9

Editorial

Year:
1989
Language:
english
File:
PDF, 330 KB
english, 1989