The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies
Wu, Y. P., Tu, P. L., Chan, Yan C.Volume:
123
Year:
2001
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1371782
File:
PDF, 431 KB
english, 2001