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Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate
Chen, Cheng, Hou, Fengze, Liu, Fengman, She, Qian, Cao, Liqiang, Wan, LixiVolume:
79
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.10.003
Date:
December, 2017
File:
PDF, 4.06 MB
english, 2017