Volume 79

Microelectronics Reliability

Volume 79

1

Effect of oxygen vacancy in tungsten oxide on the photocatalytic activity for decomposition of organic materials in the gas phase

Fukushi, Daisuke, Sasaki, Akito, Hirabayashi, Hideaki, Kitano, Masaaki

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 270 KB

english, 2017

2

Solder joint fatigue life prediction using peridynamic approach

Baber, Forrest, Guven, Ibrahim

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.82 MB

english, 2017

3

Growth competition between layer-type and porous-type Cu 3 Sn in microbumps

Chu, David T., Chu, Yi-Cheng, Lin, Jie-An, Chen, Yi-Ting, Wang, Chun-Chieh, Song, Yen-Fang, Chiang, Cheng-Cheng, Chen, Chih, Tu, K.N.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.25 MB

english, 2017

4

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate

Chen, Cheng, Hou, Fengze, Liu, Fengman, She, Qian, Cao, Liqiang, Wan, Lixi

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 4.06 MB

english, 2017

5

Trend of the development of metal-based heat dissipative materials

Mizuuchi, Kiyoshi, Inoue, Kanryu, Agari, Yasuyuki

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.97 MB

english, 2017

6

Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering

Najib, A.M., Abdullah, M.Z., Saad, A.A., Samsudin, Z., Che Ani, F.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.20 MB

english, 2017

7

BTI mitigation by anti-ageing software patterns

Abbas, Haider Muhi, Halak, Basel, Zwolinski, Mark

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.61 MB

english, 2017

8

Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy

Meszmer, Peter, Rodriguez, Raul D., Sheremet, Evgeniya, Zahn, Dietrich R.T., Wunderle, Bernhard

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.14 MB

english, 2017

9

Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments

Wu, Jie, Xue, Songbai, Wang, Jingwen, Wang, Jianxin

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 5.41 MB

english, 2017

10

Nucleation and shrinkage of defects on the surface of tin induced by local strain distribution

Shibutani, Tadahiro, Sun, Jing Wen

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 919 KB

english, 2017

11

Direct observation of changes in the effective minority-carrier lifetime of SiN x -passivated n-type crystalline-silicon substrates caused by potential-induced degradation and recovery tests

Nishikawa, Naoyuki, Yamaguchi, Seira, Ohdaira, Keisuke

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 543 KB

english, 2017

12

Effects of nooks configuration on hydrothermal performance of zigzag channels for nanofluid-cooled microelectronic heat sink

Khoshvaght-Aliabadi, M., Hassani, S.M., Mazloumi, S.H., Nekoei, M.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.58 MB

english, 2017

13

Modelling the temperature influence on dc characteristics of the IGBT

Górecki, Paweł, Górecki, Krzysztof, Zarębski, Janusz

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 868 KB

english, 2017

14

Cycle life estimation of lithium-ion polymer batteries using artificial neural network and support vector machine with time-resolved thermography

Zhou, Xunfei, Hsieh, Sheng-Jen, Peng, Bo, Hsieh, Daniel

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.44 MB

english, 2017

15

Analysis of deep level defects in bipolar junction transistors irradiated by 2 MeV electrons

Ma, Yao, Xu, Pengfei, Guan, Mingyue, Boi, Filippo, Bo, Gao, Gong, Min, Wu, Xue, Wang, Yuxin, Wang, Hua, Niao, ZengQiang

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 719 KB

english, 2017

16

The phenomenon of tin pest: A review

Cornelius, Ben, Treivish, Shay, Rosenthal, Yair, Pecht, Michael

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.42 MB

english, 2017

17

Harmonic distortion analysis of triple gate SOI nanowire MOSFETS down to 100 K

Paz, B.C., Doria, R.T., Cassé, M., Barraud, S., Reimbold, G., Vinet, M., Faynot, O., Pavanello, M.A.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.75 MB

english, 2017

18

Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps

Liu, Fan, Su, Lei, Fan, Mengying, Yin, Jian, He, Zhenzhi, Lu, Xiangning

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 2.70 MB

english, 2017

19

Comparing the degradation effect of a ‘two-cell’ Supercapacitor-module with and without voltage equalization circuit(s) under experimental self-discharge and load cycling tests

Ahmad Abubakar, Hadiza, Isa, Dino, Wan, Wong Yee

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.87 MB

english, 2017

20

Reliability of MEMS shallow arches based actuator under the combined effect of mechanical shock and electric loads

Ouakad, Hassen M., AlQasimi, Jihad E.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 928 KB

english, 2017

21

Investigation on X-ray irradiation on nanoscale nitride based charge trapping flash memory devices

Lee, Meng Chuan, Wong, Hin Yong

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.97 MB

english, 2017

22

Improved reliability characteristics of Ge MOS devices by capping Hf or Zr on interfacial layer

Li, Yan-Lin, Chang-Liao, Kuei-Shu, Chang, Yu-Wei, Huang, Tse-Jung, Li, Chen-Chien, Gu, Zhao-Chen, Chen, Po-Yen, Wu, Tzung-Yu, Huang, Jiayi, Chu, Fu-Chuan, Yi, Shih-Han

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 810 KB

english, 2017

23

Inside Front Cover - Editorial Board Page

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 42 KB

english, 2017