Si amorphization by focused ion beam milling: Point defect...

Ultramicroscopy 2018 / 01 Vol. 184

Si amorphization by focused ion beam milling: Point defect model with dynamic BCA simulation and experimental validation

Huang, J., Loeffler, M., Muehle, U., Moeller, W., Mulders, J.J.L., Kwakman, L.F.Tz., Van Dorp, W.F., Zschech, E.
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Volume:
184
Language:
english
Journal:
Ultramicroscopy
DOI:
10.1016/j.ultramic.2017.10.011
Date:
January, 2018
File:
PDF, 1.36 MB
english, 2018
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