Numerical Modeling of Forced Convection Heat Transfer for...

Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards

Agonafer, D., Moffatt, D. F.
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Volume:
112
Year:
1990
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2904386
File:
PDF, 533 KB
english, 1990
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