Volume 112; Issue 4

Journal of Electronic Packaging

Volume 112; Issue 4
6

Mechanical Behavior of Flip-Chip Encapsulants

Year:
1990
Language:
english
File:
PDF, 687 KB
english, 1990
10

Strains in Aluminum-Adhesive-Ceramic Trilayers

Year:
1990
Language:
english
File:
PDF, 1.42 MB
english, 1990