Time Integration Algorithm for a Cyclic Damage Coupled...

Journal of Electronic Packaging 2004 Vol. 126; Iss. 1

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Yang, Xianjie, Chow, C. L., Lau, K. J.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
126
Year:
2004
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1649246
File:
PDF, 417 KB
english, 2004
Conversion to is in progress
Conversion to is failed