Experimental Study of Void Formation in Eutectic and...

Journal of Electronic Packaging 2006 Vol. 128; Iss. 3

Experimental Study of Void Formation in Eutectic and Lead-Free Solder Bumps of Flip-Chip Assemblies

Wang, Daijiao, Panton, Ronald L.
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Volume:
128
Year:
2006
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2229215
File:
PDF, 840 KB
english, 2006
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