Flip-Chip Ball Grid Array Lead-Free Solder Joint Under...

Journal of Electronic Packaging 2005 Vol. 127; Iss. 4

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Jen, Ming-Hwa R., Liu, Lee-Cheng, Wu, Jenq-Dah
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Volume:
127
Year:
2005
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2070090
File:
PDF, 695 KB
english, 2005
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